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RF Components Thin-film capacitors in 0402 with a high Q fac

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Z-match capacitors feature tight tolerances and a high self-resonant frequency

 

August 18, 2011
 
TDK-EPC, a group company of TDK Corporation, presents the new TDK TFSQ0402 series of thin-film capacitors in a 0402 (EIA 01005) package. Under the product name Z-match the new capacitors are designed for power amplifier circuits and RF matching circuits in smart­phones, mobile phones, wireless LANs and other communication technologies. Mass production started inAugust 2011.
 
In order to create the new line of high-frequency components with low ESL and ESR, TDK?EPC applied TDK’s advanced thin-film technology know-how that is used to manu­facture HDD magnetic heads. The result is a new line of compact, low-profile components with outstanding performance. Thanks to the thin-film process Z-match capacitors achieve 
an extremely tight tolerance of ± 0.05 pF and a Q factor that is 150 percent higher than that of existing products (2.2 pF at 2 GHz). Furthermore, the new components offer an excellent high self-resonant frequency (SRF) of 6.8 GHz (2.2 pF). With these features, the new series exhibits superior high-frequency characteristics in impedance matching circuits
 
The terminations of the Z-match series are located on the bottom surface of the components, and a very exact dicing process ensures that the component dimensions are extremely precise, thus making them especially suitable for mounting on modules.
 
The components have an operating temperature range of -55 to +125 °C and are designed for use at high frequencies from 2.4 to 6 GHz.

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